Maximum PCB size: 400×305 mmMaximum BGA chip size: 70×70 mmMaximum temperature: 400 °C
Maximum power: 210 W3 channels: CH1: 32 V / 3 A, CH2: 32 V / 3 A, CH3: 6 V / 3 A
2 component placement headsMaximum PCB size: 320 × 450 mmPlacement speed: 5,500 pcs/h
2 channels100 MHz
2 channelsSampling rate: 250 MS/s
2 oscilloscope channels16 logic analyzer channels20 MHz
2 channels1 GS/S350 MHz
Resolution: 6½ digitsDC accuracy: 0.0015%AC accuracy: 0.06%Resistance accuracy: 0.06%DC voltage range: 0–1000 VMaximum frequency: 300 kHz